Aluminum Base PCB
Since LED Lighting product provides huge energy saving with long product life, it become very common for Home/ Commercial/ Industrial Lighting applications. LED chips create a lot of heat which require better thermal conductive PCB materials. PCE provides many options for Metal Core materials for our clients by different thermal conductivities/ copper foil thicknesses/ Aluminum Thicknesses/ Prepreg Thicknesses.
Feature | Capability |
---|---|
Thermal Conductivity | 2/3/5/8 W/m℃ |
Copper Foil Thickness | 0.5/ 1/ 2/ 3/ 4/ 5 oz |
Aluminum Thickness | 0.4/0.6/0.8/1.0/1.5/2.0 mm |
Prepreg Thickness | 4/ 5/ 6/ 7 mil |
Chip on Board PCB (Copper Base)
PCE also provides customized Hybrid Material for COB(Chip on Board) PCBs. Multiple LED chips can be attached to heat sink directly without any dielectric material. By using these special structures, we can achieve the ultimate solution for thermal conductivity.
Rigid PCB Capability
Feature | Capability | |
---|---|---|
Lamination | Layer count | 1-32 layers |
Min. thickness | 4 mil(0.1 mm) | |
Max working panel size | 24x31.5 inch(610x800mm) | |
Max. aspect ratio | 10:1 | |
Copper | Copper Thickness | 0.33~3.0 oz (11~105um) |
Trace | Min. Line Width /Space | 3/3 mil |
Routing | Dimension tolerance | +/- 2 mil (0.05mm) |
Solder Mask | S/M minimum dam width | 2.5 mil |
Impedance Control | Differential pair | +/- 10% |
Mechanical Drilling | Min. drilling hole size | 4 mil(0.1mm) |
3 Axis | Depth control accuracy | +/- 2mil (0.05mm) |
Material Availability | FR-4, High Tg FR-4, Halogen-free FR-4, Metal Core, Low Dk/Df (ISOLA/ Rogers) | |
Finish Availability | Lead-free HASL, HASL, OSP, ENIG, Pattern Gold Plating, Immersion Silver/Tin, Carbon Ink |